Browsing Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir. by Author "arifanuar@unimap.edu.my"
Now showing items 1-20 of 28
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Bonding strength characteristics of FA-based geopolymer paste as a repair material when applied on OPC substrate
Warid Wazien, Ahmad Zailani; Bouaissi, Aissa; Mohd Mustafa Al Bakri, Abdullah; Rafiza, Abd Razak; Yoriya, Sorachon; Mohd Arif Anuar, Mohd Salleh; Mohd Remy Rozainy, M. A. Z.; Hamzah, Fansuri (MDPI AG, 2020-05)This investigative study aims to study the mechanical and morphological properties of fly ash (FA)-based geopolymer paste as a repair material when applied on ordinary Portland cement (OPC) overlay concrete. The first ... -
A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
Mohd Arif Anuar, Mohd Salleh; Mohd Mustafa Al Bakri, Abdullah; Sandu, Andrei Victor; Norainiza, Saud; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; McDonald, Stuart D.; Nogita, Kazuhiro (Syscom 18 SRL, 2013-07)The properties of Sn-0.7Cu solder bulk prepared via the powder metallurgy (PM) method were investigated and compared with solder bulk fabricated through casting. Distinct microstructures were observed in both PM and casting ... -
Compressive strength and morphology of fly ash based geopolymer as artificial aggregate with different curing temperature
Alida, Abdullah; Mohd Mustafa Al Bakri, Abdullah; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Che Mohd Ruzaidi, Ghazali, Prof. Madya; Zarina, Yahya; Mohd Arif Anuar, Mohd Salleh; Nurhamidah, Zakaria; Muhammad Faheem, Mohd Tahir (Trans Tech Publications, 2014)This paper presented the compressive strength of geopolymer paste with different NaOH concentration and morphology analysis for sintered artificial aggregate. This artificial aggregate was produce based on mix design with ... -
Effect of aging time towards intermetallic compound (IMC) growth kinetics formation for Sn-0.7Cu-Si3N4 composite solder on copper substrate
Mohd Arif Anuar, Mohd Salleh; Noraniza, Saud; Najib Saedi, Ibrahim (Trans Tech Publications, 2013)The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic assemblies industry. In this investigation, we used Sn-0.7Cu/1.0-Si3N4 composite solder to analyze its ... -
The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
Mohd Izrul Izwan, Ramli; Mohd Arif Anuar, Mohd Salleh; H., Yasuda; J., Chaiprapa; K., Nogita (Elsevier, 2019-10)This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the microstructure, electrical, wettability and mechanical properties of the Sn-0.7Cu-0.05Ni as a high strength solder. Besides using the ... -
The effect of different alkaline treatment condition on flexural properties of kenaf bast- unsaturated polyester composite
Rozyanty, Abdul Rahman; Nur Firdaus, M. Y.; Mohd Arif Anuar, Mohd Salleh; Luqman, Musa, Dr. (Trans Tech Publications, 2013)The biocomposites were prepared by using kenaf bast fiber mat as reinforcing materials at different percentage. The kenaf bast fiber was treated with alkaline at different sodium hydroxide (NaOH) percentage. From the results ... -
The effect of different sizes "Batu Reput" (Dolomite) as a filler in SMR L and ENR-50
J. N., M. Ridhwan; Nik Noriman, Zulkepli, Dr.; Mohd Arif Anuar, Mohd Salleh; Sam, Sung Ting, Dr.; Luqman, Musa, Dr.; Nik Zakaria, Nik Yahya (Trans Tech Publications, 2013)The effects of different sizes of "Batu Reput" (Dolomite) filler which are smaller size (<63μm) and bigger size (75-150μm) on tensile and morphological properties of "Batu Reput" (Dolomite) filled SMR L and epoxidized ... -
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
Mohd Izrul Izwan, Ramli; Mohd Arif Anuar, Mohd Salleh; Rita, Mohd Said; Mohd Mustafa Al Bakri, Abdullah; Dewi Suriyani, Che Halin; Norainiza, Saud; Nabiałek, Marcin (MDPI AG, 2021-02)The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength ... -
Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints
Mohd Arif Anuar, Mohd Salleh; Somidin, Flora; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Mayappan, Ramani; Noor Farhani, Mohd Alui (Trans Tech Publications, 2013)Varying amount of recycled-Aluminium (0, 3.0, 3.5 and 4.0 wt.% re-Al) particulates produced from aluminium beverage cans were successfully reincorporated into Sn-0.7Cu base matrix solder material via powder metallurgy ... -
High temperature creep and hydrogen embrittlement failure of a steam trap bypass tube
Mohd Arif Anuar, Mohd Salleh; Shaiful Rizam, Shamsudin; Darwin, Sebayang, Ir. Ing. Prof. Dr; Nik Noriman, Zulkepli; Sitompul, Anton; DIC, Syahril (Trans Tech Publications, 2013)A coal fired power plant with its normal operation temperature of 540°C in which its steam trap bypass tube in that power plant was totally fractured. The aim of this study is to explore the evidence related to the steam ... -
Influence of kaolin geopolymer ceramic additions to the wettability and electrical properties of Sn-3.0Ag-0.5Cu (SAC305) lead free solder
Nur Syahirah, Mohamad Zaim; Mohd Arif Anuar, Mohd Salleh; Mohd Mustafa Al Bakri, Abdullah; Marliza, Mostapha; Romisuhani, Ahmad (IOP Publishing Ltd, 2019-12)The effect of kaolin geopolymer ceramic addition to the wettability and electrical resistivity of Sn-3.0Ag-0.5Cu (SAC305) lead free solder was successfully explored. Powder metallurgy with microwave sintering method was ... -
Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
Flora Somidin; Mohd Arif Anuar, Mohd Salleh; Khairel Rafezi, Ahmad, Dr. (Scientific.Net, 2012-12)Feasibility of using recycled-Aluminum (re-Al) as reinforcement particulates in Sn-0.7Cu is assessed by powder technology method, whereby re-Al particulates are produced from discarded aluminum beverage cans. This paper ... -
Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder
Norainiza, Saud; Najib Saedi, Ibrahim; Mohd Arif Anuar, Mohd Salleh (Trans Tech Publications, 2014)The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic devices industry. In this study, we used Sn-Cu-Si₃N₄ composite solder to observe the intermetallic compound ... -
Metallurgical failure analysis of a closed recirculation system water cooling pipe
Mohd Arif Anuar, Mohd Salleh; Shaiful Rizam, Shamsudin; Azmi, Kamardin; Noor Hamidi, Mohd Noor; Hafizan, Hassan (Trans Tech Publications, 2013)Catastrophic failure is often associated with a large temperature rise. This situation may lead to a drastic deterioration in material strength where a cooling system is important for a smooth system plant operation to ... -
Microstructure studies on different types of Geopolymer materials
Mohd Mustafa Al Bakri, Abdullah; Adila, Abdullah; Muhammad Faheem, Mohd Tahir; Che Mohd Ruzaidi, Ghazali, Assoc. Prof.; Mohd Arif Anuar, Mohd Salleh; Sandu, AV (Trans Tech Publications, 2013)Geopolymer is a new binding material produced to substitute the ordinary Portland cement (OPC) function as a binder in concrete. As we know, different types of geopolymer will have different properties. In this research, ... -
Mixing optimization of Sn-Cu-Si₃N₄ via powder metallurgy route for composite solder fabrication
Muhammad Hafiz, Zan Hazizi; Mohd Arif Anuar, Mohd Salleh; Zainal Arifin, Ahmad, Prof. (Trans Tech Publications, 2014)The aim of this study was to optimize the mixing process of a composite solder fabricated via powder metallurgy route, before details study were conducted in the next stage. Powder of Sn, Cu and Si₃N₄ were carefully weighted, ... -
Natural rubber/styrene butadiene rubber/recycled nitrile glove (NR/SBR/rNBRg) ternary blend: Curing characteristics and swelling test
Nik Zakaria, Nik Yahya; Nik Noriman, Zulkepli, Dr.; Mohd Arif Anuar, Mohd Salleh; Hanafi, Ismail, Prof.; Ragunathan, Santiagoo (Trans Tech Publications, 2014)Curing characteristics and swelling behavior of natural rubber/styrene butadiene rubber/recycled nitrile glove (NR/SBR/rNBRg) blends were investigated. Eleven composition ratio; 50/50/0, 50/40/10, 50/30/20, 50/20/30, ... -
Nickel (Ni) microalloying additions in Sn-Cu lead-free solder. short review
Mohd Arif Anuar, Mohd Salleh; Sandu, I G; Mohd Mustafa Al Bakri, Abdullah; Sandu, I (IOP Publishing Ltd, 2017-06)In this digital-age era, solder plays important role in electronic packaging industries. As interconnects material, solder provide an electrical and mechanical support to the electronics devices. Solder usually consist of ... -
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
Mohd Arif Anuar, Mohd Salleh; McDonald, Stuart D.; Nogita, Kazuhiro (Trans Tech Publications, 2013)To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders. ... -
Overview of pathogenic micro-organisms destruction in contaminated water by oxide photocatalysis
Noor Azira, Mohd Noor; Muhammad Asri, Idris, Dr.; Dewi Suriyani, Che Halin, Dr.; Mohd Nazree, Derman, Dr.; Mohd Arif Anuar, Mohd Salleh (Trans Tech Publications, 2013)The titanium dioxide (TiO2) is a semiconductor oxide photocatalys, which is chemically and biologically inert but exhibits excellent photolytic activity in the ultraviolet (UV) region. Progress in photocatalytic water ...