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    • A review of geopolymer ceramic as a potential reinforcement material in solder alloys 

      Nur Nadiah‘Izzati, Zulkiflii; Mohd Mustafa Al Bakri, Abdullah; Mohd Arif Anuar, Mohd Salleh (IOP Publishing Ltd, 2019-12)
      Nowadays, lead-free solder has been currently used in electronic packaging technology as part of soldering material. Since SnPb was detected to produce toxicity and might harm the consumers, the usage of Pb solder has been ...