Now showing items 39-43 of 43

    • Strength of concrete based cement using recycle ceramic waste as aggregate 

      Mohd Mustafa Al-Bakri, Abdullah; Norazian, Mohamed Noor; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Mohd Arif Anuar, Mohd Salleh; Adila, Abdullah (Trans Tech Publications, 2013)
      The main focus of this research is to study the strength of concrete with ceramic waste as coarse aggregate. The sources of ceramic waste are obtained from the industrial in Malaysia. Presently, in ceramics industries the ...
    • Synthesis and characterization of electroless copper coated SiC particles 

      Azmi, Kamardin; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman, Dr. (Trans Tech Publications, 2013)
      Silicon carbide reinforced copper matrix (Cu-SiCp) composites fabricated via the conventional powder metallurgy methods have inferior thermophysical properties due to the weak bonding between the copper matrix and the SiCp ...
    • Synthesis and charactherization of TiO₂ doped SnO₂ thin film prepared by sol-gel method 

      Dewi Suriyani, Che Halin; Kamrosni, Abdul Razak; Azliza, Azani; Mohd Mustafa Al Bakri, Abdullah; Mohd Arif Anuar, Mohd Salleh; Norsuria, Mahmed; Nur Syahirah, Shafee; Muhammad Mahyiddin, Ramli; Ayu Wazira, Azhari; Chobpattana, Varistha (IOP Publishing Ltd, 2019-12)
      In this work, preparation of titanium dioxide doped with tin oxide, SnO₂/TiO₂ thin films deposited onto silicon wafer via sol-gel method. Different amount of SnO₂ was added (5 ml, 10ml and 15 ml) into parent solution. The ...
    • Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder 

      Mohd Arif Anuar, Mohd Salleh; Somidin, Flora; Nik Noriman, Zulkepli, Dr.; Khairel Rafezi, Ahmad, Dr.; Mayappan, Ramani; Noor Farhani, Mohd Alui (Trans Tech Publications, 2013)
      Composite approach in lead-free solder development was perceived as an expectation in finding new robust solder. Accordingly, Sn-0.7Cu/re-Al composite lead-free solder with varying amount of recycled-Aluminium (0, 3.0, 3.5 ...
    • Zn-Sn based high temperature solder - A short review 

      Sayyidah Amnah, Musa; Mohd Arif Anuar, Mohd Salleh; Norainiza, Saud (Trans Tech Publications, 2013)
      The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high ...