Browsing Mohd Arif Anuar Mohd Salleh, Associate Professor Dr. Ir. by Title

Now showing items 35-43 of 43

    • Recent graphene oxide/TiO₂ thin film based on self-cleaning application 

      A. Azani; Dewi Suriyani, Che Halin; Kamrosni, Abdul Razak; Mohd Mustafa Al Bakri, Abdullah; Mohd Arif Anuar, Mohd Salleh; Norsuria, Mahmed; Muhammad Mahyiddin, Ramli; Ayu Wazira, Azhari; Chobpattana, V. (IOP Publishing Ltd, 2019-08)
      Graphene oxide/TiO₂ (GO/TiO₂) thin films works as self-cleaning device have been developed in various method onto selected substrates. It was noticeable that graphene oxide is the best form in the group of graphene family. ...

    • Research advances of composite solder material fabricated via powder metallurgy route 

      Mohd Arif Anuar, Mohd Salleh; Muhammad Hafiz, Hazizi; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Ramani, Mayapan; Zainal Ariffin, Ahmad (Scientific.Net/Trans Tech Publications, 2012-12)
      Researches and studies on composite solder have been done by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders as lead is considered as toxic. Solder ...

    • Research development of solder materials and its intermetallic compound (IMC) study 

      Mohd Arif Anuar, Mohd Salleh; Najib Saedi, Ibrahim; Saud, N.; Mohd Mustafa Al Bakri, Abdullah; Nik Noriman, Zulkepli; Ramani, Mayapan; Zainal Ariffin, Ahmad (Scientific.Net/Trans Tech Publications, 2012-12)
      Nowadays, the formation and the subsequent growth of the intermetallic compounds (IMCs) and the development of new lead-free solder systems is a major issue in soldering. The excessive growth formation of intermetallic ...

    • A review of geopolymer ceramic as a potential reinforcement material in solder alloys 

      Nur Nadiah‘Izzati, Zulkiflii; Mohd Mustafa Al Bakri, Abdullah; Mohd Arif Anuar, Mohd Salleh (IOP Publishing Ltd, 2019-12)
      Nowadays, lead-free solder has been currently used in electronic packaging technology as part of soldering material. Since SnPb was detected to produce toxicity and might harm the consumers, the usage of Pb solder has been ...

    • Strength of concrete based cement using recycle ceramic waste as aggregate 

      Mohd Mustafa Al-Bakri, Abdullah; Norazian, Mohamed Noor; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Mohd Arif Anuar, Mohd Salleh; Adila, Abdullah (Trans Tech Publications, 2013)
      The main focus of this research is to study the strength of concrete with ceramic waste as coarse aggregate. The sources of ceramic waste are obtained from the industrial in Malaysia. Presently, in ceramics industries the ...

    • Synthesis and characterization of electroless copper coated SiC particles 

      Azmi, Kamardin; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman, Dr. (Trans Tech Publications, 2013)
      Silicon carbide reinforced copper matrix (Cu-SiCp) composites fabricated via the conventional powder metallurgy methods have inferior thermophysical properties due to the weak bonding between the copper matrix and the SiCp ...

    • Synthesis and charactherization of TiO₂ doped SnO₂ thin film prepared by sol-gel method 

      Dewi Suriyani, Che Halin; Kamrosni, Abdul Razak; Azliza, Azani; Mohd Mustafa Al Bakri, Abdullah; Mohd Arif Anuar, Mohd Salleh; Norsuria, Mahmed; Nur Syahirah, Shafee; Muhammad Mahyiddin, Ramli; Ayu Wazira, Azhari; Chobpattana, Varistha (IOP Publishing Ltd, 2019-12)
      In this work, preparation of titanium dioxide doped with tin oxide, SnO₂/TiO₂ thin films deposited onto silicon wafer via sol-gel method. Different amount of SnO₂ was added (5 ml, 10ml and 15 ml) into parent solution. The ...

    • Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder 

      Mohd Arif Anuar, Mohd Salleh; Somidin, Flora; Nik Noriman, Zulkepli, Dr.; Khairel Rafezi, Ahmad, Dr.; Mayappan, Ramani; Noor Farhani, Mohd Alui (Trans Tech Publications, 2013)
      Composite approach in lead-free solder development was perceived as an expectation in finding new robust solder. Accordingly, Sn-0.7Cu/re-Al composite lead-free solder with varying amount of recycled-Aluminium (0, 3.0, 3.5 ...

    • Zn-Sn based high temperature solder - A short review 

      Sayyidah Amnah, Musa; Mohd Arif Anuar, Mohd Salleh; Norainiza, Saud (Trans Tech Publications, 2013)
      The developments of lead-free solders have become a major concern to the researchers in electronic industry to replace the lead-containing materials. The concern is not just for low temperature solders but also for high ...