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    • Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste 

      Rita, Mohd Said; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Mohd Izrul, Izwan Ramli; Norhayanti, Mohd Nasir; Norainiza, Saud (Trans Tech Publications Ltd., 2016-07)
      This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste ...