Browsing Center of Excellence for Geopolymer and Green Technology (CEGEOGTECH) (Articles) by Author "arifanuar@unimap.edu.my"
Now showing items 1-5 of 5
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Compressive strength and morphology of fly ash based geopolymer as artificial aggregate with different curing temperature
Alida, Abdullah; Mohd Mustafa Al Bakri, Abdullah; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr.; Che Mohd Ruzaidi, Ghazali, Prof. Madya; Zarina, Yahya; Mohd Arif Anuar, Mohd Salleh; Nurhamidah, Zakaria; Muhammad Faheem, Mohd Tahir (Trans Tech Publications, 2014)This paper presented the compressive strength of geopolymer paste with different NaOH concentration and morphology analysis for sintered artificial aggregate. This artificial aggregate was produce based on mix design with ... -
The effect of different sizes "Batu Reput" (Dolomite) as a filler in SMR L and ENR-50
J. N., M. Ridhwan; Nik Noriman, Zulkepli, Dr.; Mohd Arif Anuar, Mohd Salleh; Sam, Sung Ting, Dr.; Luqman, Musa, Dr.; Nik Zakaria, Nik Yahya (Trans Tech Publications, 2013)The effects of different sizes of "Batu Reput" (Dolomite) filler which are smaller size (<63μm) and bigger size (75-150μm) on tensile and morphological properties of "Batu Reput" (Dolomite) filled SMR L and epoxidized ... -
Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste
Rita, Mohd Said; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Mohd Izrul, Izwan Ramli; Norhayanti, Mohd Nasir; Norainiza, Saud (Trans Tech Publications Ltd., 2016-07)This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste ... -
Low and high temperature isothermal aging effect on morphology and diffusion kinetics of intermetallic compound (IMC) for Sn-Cu-Si ₃N₄ composite solder
Norainiza, Saud; Najib Saedi, Ibrahim; Mohd Arif Anuar, Mohd Salleh (Trans Tech Publications, 2014)The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic devices industry. In this study, we used Sn-Cu-Si₃N₄ composite solder to observe the intermetallic compound ... -
Natural rubber/styrene butadiene rubber/recycled nitrile glove (NR/SBR/rNBRg) ternary blend: Curing characteristics and swelling test
Nik Zakaria, Nik Yahya; Nik Noriman, Zulkepli, Dr.; Mohd Arif Anuar, Mohd Salleh; Hanafi, Ismail, Prof.; Ragunathan, Santiagoo (Trans Tech Publications, 2014)Curing characteristics and swelling behavior of natural rubber/styrene butadiene rubber/recycled nitrile glove (NR/SBR/rNBRg) blends were investigated. Eleven composition ratio; 50/50/0, 50/40/10, 50/30/20, 50/20/30, ...