Browsing Universiti Malaysia Perlis by Subject "Underfill material in electronic packaging"
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Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
(Universiti Sains Malaysia, 2012-07-17)Underfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system.