Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application
Aida Fakhrul, Lamakasauk
Nurul Shakina, Surani
Mohd Arif Anuar, Mohd Salleh
Nik Noriman, Zulkepli, Dr.
Mohd Mustafa Al-Bakri, Abdullah
Mohamad, Abu Bakar
MetadataShow full item record
Underfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system.