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Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application

dc.contributor.authorAida Fakhrul, Lamakasauk
dc.contributor.authorNurul Shakina, Surani
dc.contributor.authorMohd Arif Anuar, Mohd Salleh
dc.contributor.authorNik Noriman, Zulkepli, Dr.
dc.contributor.authorMohd Mustafa Al-Bakri, Abdullah
dc.contributor.authorRosniza, Hamzah
dc.contributor.authorMohamad, Abu Bakar
dc.date.accessioned2013-06-11T09:17:04Z
dc.date.available2013-06-11T09:17:04Z
dc.date.issued2012-07-17
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/25704
dc.descriptionThis team has won gold medal at National Research and Innovation Competition (NRIC) 2012, 17th - 19th July 2012 was held at Dewan Utama Pelajar, located at USM Main Campus, Penang, Malaysia.en_US
dc.description.abstractUnderfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system.en_US
dc.publisherUniversiti Sains Malaysiaen_US
dc.relation.ispartofseriesNational Research and Innovation Competition (NRIC) 2012en_US
dc.subjectUnderfill materialen_US
dc.subjectPolymer hybriden_US
dc.subjectEpoxy polymeren_US
dc.subjectUnderfill material in electronic packagingen_US
dc.subjectUniMAP -- Research and developmenten_US
dc.subjectUniMAP -- Competitionen_US
dc.subjectNational Research and Innovation Competition 2012en_US
dc.subjectNRIC 2012en_US
dc.titleGreen underfill - a novel green polymer hybrid as underfill material in electronic packaging applicationen_US
dc.contributor.urlarifanuar@unimap.edu.myen_US


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