Browsing Research & Innovations by Author "Mohd Arif Anuar, Mohd Salleh"

Now showing items 1-3 of 3

    • Graphite as an intermetallic compound (IMC) substitution for a robust solder joint 

      Fatin Afeeqa, Mohd Sobri; Norhayanti, Mohd Nasir; Rita, Mohd Said; Mohd Izrul Izwan, Ramli; Muhammad Hafiz, Zan@Hazizi; Azmi, Kamardin; Mohd Arif Anuar, Mohd Salleh (Universiti Malaysia Perlis (UniMAP), 2015-04-17)
      Conventionally, Sn-Pb types of solder were highly used in the electronic packaging industries as it excels in most of its properties. But, then it was realized that lead (Pb) were hazardous to the invironment and human ...

    • Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application 

      Aida Fakhrul, Lamakasauk; Nurul Shakina, Surani; Mohd Arif Anuar, Mohd Salleh; Nik Noriman, Zulkepli, Dr.; Mohd Mustafa Al-Bakri, Abdullah; Rosniza, Hamzah; Mohamad, Abu Bakar (Macao Innovation & Invention Association, 2012-06-29)
      Underfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system.

    • Green underfill - a novel green polymer hybrid as underfill material in electronic packaging application 

      Aida Fakhrul, Lamakasauk; Nurul Shakina, Surani; Mohd Arif Anuar, Mohd Salleh; Nik Noriman, Zulkepli, Dr.; Mohd Mustafa Al-Bakri, Abdullah; Rosniza, Hamzah; Mohamad, Abu Bakar (Universiti Sains Malaysia, 2012-07-17)
      Underfill is a material used to provide a stronger mechanical connection, provide heat bridge and to ensure the soldier joint are not stressed out due to differential heating on the chip and the rest of system.