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dc.contributor.authorUda, Hashim, Prof. Dr.
dc.date.accessioned2013-07-13T05:44:04Z
dc.date.available2013-07-13T05:44:04Z
dc.date.issued2012-06-06
dc.identifier.citationAIP Conference Proceedings, vol. 1502(1), 2012, pages 26-33en_US
dc.identifier.isbn978-0-7354-1119-7
dc.identifier.issn0094-243X
dc.identifier.urihttp://proceedings.aip.org/resource/2/apcpcs/1502/1/26_1
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/26633
dc.descriptionLink to publisher's homepage at http://www.aip.org/en_US
dc.description.abstractSilicon nanowires (SiNWs) have attracted significant interest in the study because of their potential to impact applications from nanoscale electronics to biomedical engineering. E-Beam Lithography couple with standard CMOS process is employed to fabricate the device. The exposure doses for the resist layer are varied in the range of 50 μC/cm2 to 180 μC/cm2 at 20 kV accelerating voltage with a beam current of 0.075 nA. The nanowires resist masks are well developed with dimension of less than 100 nm in width for the dose exposure parameters of 80 μC/cm2, 100 μC/cm2 and 120 μC/cm2. It is found that, the smallest SiNW with diameter of 65 nm is well aligned with electrode pads. In terms of sensitivity, the device with smaller nanowire is found to be more sensitive as a result of the high surface-to-volume ratio. These results demonstrate that the in-house fabricated SiNWs biosensor is capable as a platform for label-free biosensing.en_US
dc.language.isoenen_US
dc.publisherAmerican Institute of Physicsen_US
dc.relation.ispartofseriesProceedings of the International Conference on Nanotechnology - Research and Commercialization (ICONT) 2011en_US
dc.subjectBiosensoren_US
dc.subjectCMOS processen_US
dc.subjectE-beam lithographyen_US
dc.subjectNanowiresen_US
dc.subjectSiliconen_US
dc.titleSilicon nanowire sensor by mix and match lithography process: Fabrication and characterizationen_US
dc.typeWorking Paperen_US
dc.contributor.urluda@unimap.edu.myen_US


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