| dc.contributor.author | Ho, Li Ngee | |
| dc.contributor.author | Nishikawa, Hiroshi | |
| dc.date.accessioned | 2013-07-10T08:45:40Z | |
| dc.date.available | 2013-07-10T08:45:40Z | |
| dc.date.issued | 2012-09 | |
| dc.identifier.citation | Journal of Electronic Materials, 2012, vol. 41(9), pages 2527-2532 | en_US |
| dc.identifier.issn | 0361-5235 | |
| dc.identifier.uri | http://link.springer.com/article/10.1007%2Fs11664-012-2102-x | |
| dc.identifier.uri | http://dspace.unimap.edu.my/123456789/26568 | |
| dc.description | Link to publisher's homepage at http://www.tms.org/ | en_US |
| dc.description.abstract | In this study, a simple one-step microwave-assisted method was developed to synthesize Cu and Cu-Ag particles for application in electrically conductive adhesive (ECA). The particle size of the obtained Cu particles was about 1 μm to 3 μm, whereas Cu-Ag particles were in the range of 0.1 μm to 1.0 μm. ECA samples were cured at 175°C for 1 h. Results revealed that the as-cured ECAs showed significant differences in electrical resistivity. The resistivity of Cu-filled ECA was on the order of 10 -5 Ω cm, which was lower than the Cu-Ag-filled ECAs with resistivity on the order of 10 -3 Ω cm. The thermal stability of the ECAs was studied under high-temperature exposure at 125°C for 1000 h. Results showed that Cu-filled ECA was thermally stable for 1000 h of aging, whereas Cu-Ag-filled ECAs were thermally stable for aging time above 100 h | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | TMS | en_US |
| dc.subject | Conductive adhesive | en_US |
| dc.subject | Copper | en_US |
| dc.subject | Electrical resistivity | en_US |
| dc.subject | Synthesis | en_US |
| dc.title | Surfactant-free synthesis of copper particles for electrically conductive adhesive applications | en_US |
| dc.type | Article | en_US |
| dc.contributor.url | holingee@yahoo.com | en_US |
