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Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive
(Taylor & Francis, 2010-08)
In this study, a pre-alloyed Cu-P powder with a trace amount of P (0.002 at.%) was used as a metallic filler in a phenolic resin-based electrically conductive adhesive (ECA). The electrical property of the Cu-P-filled ECA ...
Electrical reliability of different alloying content on copper alloy fillers in electrically conductive adhesives
(Springer, 2011)
The thermal stability and electrical reliability of electrically conductive adhesives (ECAs)
filled with Cu fillers alloying with different amount of Ag and Mg (0.2-1.5 at.%),
respectively, were studied by comparing their ...
Effect of different copper fillers on the electrical resistivity of conductive adhesives
(Springer Science+Business Media, LLC, 2011-05)
The effects of different copper fillers with different morphology and particle size have been studied in terms of electrical resistivity and thermal stability on the electrically conductive adhesives. The copper fillers ...