Browsing School of Materials Engineering (Articles) by Subject "Aging"
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Electrical properties of pre-alloyed Cu-P containing electrically conductive adhesive
(Taylor & Francis, 2010-08)In this study, a pre-alloyed Cu-P powder with a trace amount of P (0.002 at.%) was used as a metallic filler in a phenolic resin-based electrically conductive adhesive (ECA). The electrical property of the Cu-P-filled ECA ...