Browsing School of Materials Engineering (Articles) by Author "zaheruddin@unimap.edu.my"

Now showing items 1-5 of 5

    • Development of dense hydroxyapatite-ni by modified electroless deposition technique. 

      Sri Asliza, Md Amin; Mohd Zaheruddin, Kasmuin; Azmi, Rahmat, Dr.; Shamsul Baharin, Jamaludin, Prof. Dr.; Khairel Rafezi, Ahmad, Dr. (Trans Tech Publications, 2014)
      Ni deposited on HA powder was prepared by electroless plating process without sensitization and activation treatment. The deposited powder obtained was characterized by energy dispersive spectroscopy (EDX) and x-ray ...

    • Effect of different nickel content on the mechanical properties of hydroxyapatite-ni composites from coated powders 

      Sri Asliza, Md Amin; Mohd Zaheruddin, Kasmuin; Azmi, Rahmat, Dr.; Shamsul Baharin, Jamaludin, Prof. Dr.; Khairel Rafezi, Ahmad, Dr. (Trans Tech Publications, 2014)
      HA-Ni composites were fabricated by uniaxial pressing from coated powders, in which HA particles were successfully coated with nickel precursor by the electroless deposition method. The compacted powders sintered at ...

    • Preparation and characterization of Co-HA powder using modified electroless method 

      Mohd Zaheruddin, Kasmuin; Sri Asliza, Md Amin; Azmi, Rahmat, Prof. Madya Dr.; Shamsul Baharin, Jamaludin, Prof. Dr.; Khairel Rafezi, Ahmad, Dr. (Trans Tech Publications, 2014)
      C0-HA composite produced by simple electroless deposition method was studied. From the particle size analysis by Malvern particles analyzer its shows that 19% increment in average of the particle size powder increase after ...

    • Sintering effects on mechanical properties of Co-HA composite prepared by modified electroless deposition. 

      Mohd Zaheruddin, Kasmuin; Sri Asliza, Md Amin; Azmi, Rahmat, Dr.; Shamsul Baharin, Jamaludin, Prof. Dr.; Khairel Rafezi, Ahmad, Dr. (Trans Tech Publications, 2014)
      Co-HA composite produced using electroless deposition without conventional sensitization and activation treatment was studied with varying sintering temperature (1100°C, 1200°C and 1250°C). The particles size, bulk density, ...

    • A study of liberation and separation process of metals from printed circuit boards (PCBS) scraps 

      Aimi Noorliyana, Hashim; Mohd Zaheruddin, Kasmuin; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (Trans Tech Publications, 2013-12)
      Since the metallic elements are covered with or encapsulated by various plastic or ceramic materials on printed circuit boards (PCBs), a pre-treatment process allowing their liberation and separation is first needed in ...