Browsing School of Materials Engineering (Articles) by Author "Saidatulakmar, Shamsuddin"

Now showing items 1-4 of 4

    • Compressive and wear resistance of alumina reinforced fe-cr matrix composites 

      Saidatulakmar, Shamsuddin; Shamsul Baharin, Jamaludin, Prof. Dr.; Zuhailawati, Hussain; Zainal Arifin, Ahmad (Scientific.Net, 2012-12)
      Fe-Cr matrix composite reinforced with alumina with mean powder sizes of 13, 23, 24 and 64 μm was successfully obtained through powder metallurgy method. The powder mixture were blended at a rotating speed of 250 rpm for ...

    • The effects of Al2O3 amount on the microstructure and properties of Fe-Cr matrix composites 

      Saidatulakmar, Shamsuddin; Shamsul Baharin, Jamaludin, Prof. Dr.; Zuhailawati, Hussain; Zainal Ariffin, Ahmad (Springer, 2010-12)
      Iron based matrix composites reinforced with 5 to 25 wt pct of Al2O3 particles were fabricated using the powder metallurgy method. The samples were prepared by mixing at 250 rpm for 30 minutes, uniaxially pressing at 750 ...

    • Microstructure and microhardness properties of Fe-Cr-Al2O3 composites 

      Saidatulakmar, Shamsuddin; Shamsul Baharin, Jamaludin, Prof. Dr.; Zuhailawati, H.; Zainal Arifin, A. (Universiti Putra Malaysia (UPM), 2010)
      The requirement for high performance materials of high wear and corrosion resistance lead to an increasing interest in ferrous matrix composites. Metal matrix composite of iron-chromium reinforced with alumina was fabricated ...

    • Microstructure evolution of Sn-3.5Ag-1.0Cu-0.5Ni/Cu system lead free solder under long term thermal aging 

      Noor Asikin, Ab Ghani; Iziana, Yahya; Mohd Arif Anuar, Mohd Salleh; Saidatulakmar, Shamsuddin; Zainal Arifin, Ahmad; Ramani, Mayappan (Scientific.Net, 2012-12)
      Due to environmental concerns, lead-free solders were introduced in replacing the lead-based solders in microelectronics devices technology. Although there are many lead-free solder available, the Sn-Ag-Cu solder was ...