Browsing School of Materials Engineering (Articles) by Author "Rahim, Atan, Prof. Madya Dr."
Now showing items 1-1 of 1
-
Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application
Mazlan, Mohamed; Rahim, Atan, Prof. Madya Dr.; Mohd Mustafa Al Bakri, Abdullah; Muhammad Iqbal, Ahmad; Mohd Huzaifah, Yusoff; Fathinul Najib, Ahmad Saad (Trans Tech Publications, 2013)Thermal pad is new technology in this world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. In electronic industry, the electronic components that exceed 70°C ...