Browsing School of Materials Engineering (Articles) by Author "Hiroshi, Nishikawa"
Now showing items 1-3 of 3
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Copper-filled electrically conductive adhesives with enhanced shear strength
Ho, Li Ngee, Dr.; Hiroshi, Nishikawa (ASM International, 2014-09)In this study, the effects of diethyl carbitol (diluent) and tertiary amines on the electrical, mechanical, and rheological properties of the Cu-filled polyurethane-based electrically conductive adhesives (ECAs) were ... -
Influence of post-curing and coupling agents on polyurethane based copper filled electrically conductive adhesives
Ho, Li Ngee, Dr.; Hiroshi, Nishikawa (Springer Science+Business Media New York, 2013-06)Effects of post curing and silane coupling agents with different functional groups such as epoxy, isocyanate and ureide on the electrical and mechanical properties of copper (Cu) filled electrically conductive adhesives ... -
Properties of phenolic-based Ag-filled conductive adhesive affected by different coupling agents
Ho, Li Ngee, Dr.; Teng, Fei Wu; Hiroshi, Nishikawa (Taylor and Francis Group, LLC., 2013-11)In this study, a phenolic-based Ag flake-filled electrically conductive adhesive (ECA) was investigated in terms of rheological, electrical, and mechanical properties. To clarify the effect of various Ag flake filler content ...