Browsing School of Materials Engineering (Articles) by Author "Flora Somidin"
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Intermetallic compound formation on solder alloy/cu-substrate interface using lead-free sn-0.7cu/recycled-aluminum composite solder
Flora Somidin; Mohd Arif Anuar, Mohd Salleh; Khairel Rafezi, Ahmad, Dr. (Scientific.Net, 2012-12)Feasibility of using recycled-Aluminum (re-Al) as reinforcement particulates in Sn-0.7Cu is assessed by powder technology method, whereby re-Al particulates are produced from discarded aluminum beverage cans. This paper ...