dc.contributor.author | Shung-Yuh, Pui | |
dc.contributor.author | Yin-Ling, Lai | |
dc.contributor.author | Ji-Jinn, Foo | |
dc.contributor.author | Swee-Boon, Chin | |
dc.date.accessioned | 2012-07-14T08:46:13Z | |
dc.date.available | 2012-07-14T08:46:13Z | |
dc.date.issued | 2012-02-27 | |
dc.identifier.uri | http://dspace.unimap.edu.my/123456789/20337 | |
dc.description | International Conference on Applications and Design in Mechanical Engineering 2012 (ICADME 2012) organized by School of Mechatronic Engineering, Universiti Malaysia Perlis (UniMAP), 27th - 28th Februari 2012 at Bayview Beach Resort, Penang, Malaysia. | en_US |
dc.description.abstract | The rapid growth in high speed multi-functional
miniaturized electronics demands more stringent thermal
management. The present work numerically investigates the use
of staggered perforated pin fins to enhance the rate of heat
transfer while subject to a vertical impinging flow. In particular,
the number of horizontal perforations and the vertical and
horizontal diameters of perforation on each pin are studied.
Results show that the Nusselt number of pins with horizontal and
vertical perforations is about 9% higher than that for the solid
pins and it increases with the number of horizontal perforations.
Pressure drop with perforated pins is reduced by about 10%
compared with that in solid pins. Perforation produces smaller
but larger number of vortices downstream of the pins which
increases convective heat transfer but reduces pressure losses.
However, further increasing the perforation diameters leads to a
significant drop in thermal dissipation. Overall, pin fins with
vertical and horizontal perforations are preferred for heat sink
facing an oncoming vertical flow. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Universiti Malaysia Perlis (UniMAP) | en_US |
dc.relation.ispartofseries | Proceedings of the International Conference on Applications and Design in Mechanical Engineering 2012 (ICADME 2012) | en_US |
dc.subject | Component | en_US |
dc.subject | Impinging flow | en_US |
dc.subject | Perforation | en_US |
dc.subject | Pin fins | en_US |
dc.subject | Forced convection | en_US |
dc.title | Forced convective heat transfer enhancement with perforated pin fins subject to impinging flow | en_US |
dc.type | Working Paper | en_US |
dc.publisher.department | Pusat Pengajian Kejuruteraan Mekatronik | en_US |
dc.contributor.url | jjfoo@segi.edu.my | en_US |