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Quantum DOT Single Electron Transistor
(School of Microelectronic Engineering, 2008-01-09)
Organic thin film transistor memories with carbon nanodots fabricated by focused ion beam chemical vapor deposition
(American Institute of Physics, 2009-06-01)
Metal-insulator-semiconductor field effect transistor (MISFET) structures with a nanocrystal carbon (nc-C) embedded in SiO2 thin films using a focused ion beam chemical vapor deposition (FIBCVD) system with a precursor of ...
Development of nanogap automated permittivity measurement system for DNA hybridization detection kit
(Institute of Electrical and Electronics Engineering (IEEE), 2009-12-14)
The Nanogap Automated Permittivity Measurement System (APMS) are fabricated as low cost, portable and label free DNA hybridization detection kit. The nanogap capacitor can react as a dna sensor. The difference in dielectric ...
Design and fabrication of Nanowire-based conductance biosensor using spacer patterning technique
(Institute of Electrical and Electronics Engineering (IEEE), 2008-12-01)
Materials have different behaviours and properties at the nanoscales (1-100nm). New theories and discoveries have been found in designing and fabricating at these sizes. Silicon Nanowires has allowed the introduction of ...
Nanowire conductance biosensor by spacer patterning lithography technique for DNA hybridization detection: Design and fabrication method
(Institute of Electrical and Electronics Engineers (IEEE), 2008-11-04)
The use of Silicon nanowires has allowed the introduction of many new signal transduction technologies in biosensors. The sensitivity and performance of biosensors is being improved by using doping process for their ...
A simple oxidation technique for quantum dot dimension shrinkage and tunnel barriers generation
(Elsevier B.V., 2007-05)
The tunnel barriers generation and the quantum dot size shrinkage play a significant role in single-electron transistor (SET) fabrication. Because the numerically etch indicators were not found, the technical indicators, ...
From sand to Silicon wafer
(Kolej Universiti Kejuruteraan Utara Malaysia, 2003-07)
A systematic dry etching process for profile control of quantum dots and nanoconstrictions
(Elsevier B.V., 2007-08)
In essence, quantum dot dimensions and others can be laterally and vertically defined by using either bottom up or top down methods respectively. In fabrication that uses top down method, etch process hold a chief role. ...
Under Bump Metallurgy (UBM)-a technology review for flip chip packaging
(Department of Mechanical Engineering, University Malaya, 2007)
Flip chip packaging technology has been utilized more than 40 years ago and it still experiencing an explosives growth. This growth is driven by the need for high performance, high volume, better reliability, smaller size ...
The effects of multiple zincation process on Aluminum Bond Pad surface for Electroless Nickel Immersion Gold deposition
(American Society of Mechanical Engineers (ASME), 2006-09)
This paper reports the effects of a multiple zincation processon the Al bond pad surface prior to electroless nickel immersion gold deposition. The study of multiple zincation comprises the surface topogtaphy and morphology ...