Now showing items 1-2 of 2

    • Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology 

      Siti Rahmah, Esa; Genesia, Omar; Siti Hajar, Sheikh Md Fadzullah; Kim, S. Siow; B. Abdul Rahim; B. Çoşut (Universiti Malaysia Perlis (UniMAP), 2020-05)
      Sintered Ag has gained strong interest as an important alternative material for interconnect technology in wide bandgap (WBG) semiconductor industries specifically for high thermal dissipations and high-speed applications. ...
    • Mechanism of current transport for a photoelectrochemical cells of ITO/Cu2O/PVC-LiClO4/graphite 

      Dewi Suriyani, Che Halin, Dr.; Haiza, Haroon; Ibrahim, Abu Talib, Prof. Dr.; Abdul Razak, Daud, Prof. Dr.; Muhammad Azmi, Abd Hamid, Assoc. Prof. Dr. (Trans Tech Publications, 2013)
      This paper deals with the current transport mechanism of solid state photoelectrochemical cells of ITO/Cu2O/PVC-LiClO4/graphite as well as the physical properties of a component of a device affecting its performance. The ...