Browsing School of Materials Engineering (Theses) by Author "Norainiza, Saud, Dr."
Now showing items 1-4 of 4
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Development od SiC reinforced SnCu and SAC based lead-free solder composite via powder metallurgy route
Zawawi, MahimNowadays, composite solder has gain researcher’s attention due to its promising improvement in physical and mechanical properties for lead free solder. This study was carried out to investigate the effect of SiC particle ... -
Development of Sn-Cu filled activated carbon composite solder via powder metallurgy technique
Sayyidah Amnah, MusaThe revolution of electronic applications which have been assembled in smaller parts, lighter and more functional, causes the solder to become crucial over the worlds. These classes of low melting point alloys must provide ... -
The development of Sn-Cu-Ni lead free composite solder influence by non-metallic reinforcement
Mohd Izrul Izwan, RamliFor several decades, Sn-Pb alloys have been extensively used as soldering material in the electronic packaging industry. Even so due to the concern on the toxicity of lead in eutectic SnPb solders, researchers have been ... -
Fabrication of SAC107 and Sn-0.7Cu lead free composite solder reinforced with Si3N4 via powder metallurgy route
Norhayanti, Mohd NasirThe composite technology is the new approach to improve the service temperature capabilities and thermal stability of the solder joints. Low-silver Sn98.3-Ag1.0-Cu0.7 (SAC107) and Sn99.3-Cu0.7 (Sn-0.7Cu) solders were used ...