Browsing by Author "Rita, Mohd Said"
Now showing items 1-7 of 7
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The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
Mohd Izrul Izwan, Ramli; Mohd Arif Anuar, Mohd Salleh; Rita, Mohd Said; Mohd Mustafa Al Bakri, Abdullah; Dewi Suriyani, Che Halin; Norainiza, Saud; Nabiałek, Marcin (MDPI AG, 2021-02)The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength ... -
Graphite as an intermetallic compound (IMC) substitution for a robust solder joint
Fatin Afeeqa, Mohd Sobri; Norhayanti, Mohd Nasir; Rita, Mohd Said; Mohd Izrul Izwan, Ramli; Muhammad Hafiz, Zan@Hazizi; Azmi, Kamardin; Mohd Arif Anuar, Mohd Salleh (Universiti Malaysia Perlis (UniMAP), 2015-04-17)Conventionally, Sn-Pb types of solder were highly used in the electronic packaging industries as it excels in most of its properties. But, then it was realized that lead (Pb) were hazardous to the invironment and human ... -
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
Mohd Izrul Izwan, Ramli; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Rita, Mohd Said; Norainiza, Saud (EDP Sciences, 2016-10)The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. ... -
An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
Norainiza, Saud; Rita, Mohd Said; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Mohd Izrul Izwan, Ramli; Norhayanti, Mohd Nasir (EDP Sciences, 2016)In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution ... -
Isothermal aging affect to the growth of Sn-Cu-Ni-1 wt. % TiO2 composite solder paste
Rita, Mohd Said; Mohd Arif Anuar, Mohd Salleh; Mohd Nazree, Derman; Mohd Izrul, Izwan Ramli; Norhayanti, Mohd Nasir; Norainiza, Saud (Trans Tech Publications Ltd., 2016-07)This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste ... -
Mechanical properties of various composition of Aluminum Matrix composite
Kamrosni, Abdul Razak; Mohd Nazree, Derman; Noraziana, Parimin; Rita, Mohd Said (Universiti Malaysia Perlis, 2009-12-01)The various composition of alumina will affect the mechanical properties of aluminum matrix composite. The properties that affect were density, percentage of porosity, arrangement of the microstructure and also the hardness. ... -
Performance of Sn-3.0Ag-0.5Cu composite solder with kaolin geopolymer ceramic reinforcement on microstructure and mechanical properties under isothermal ageing
Nur Syahirah, Mohamad Zaimi; Mohd Arif Anuar, Mohd Salleh; Sandu, Andrei Victor; Mohd Mustafa Al Bakri, Abdullah; Norainiza, Saud; Shayfull Zamree, Abd Rahim; Vizureanu, Petrica; Rita, Mohd Said; Mohd Izrul, Izwan Ramli (MDPI AG, 2021-02)This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) ...