Graphite as an intermetallic compound (IMC) substitution for a robust solder joint

Abstract

Conventionally, Sn-Pb types of solder were highly used in the electronic packaging industries as it excels in most of its properties. But, then it was realized that lead (Pb) were hazardous to the invironment and human health, so it was banned and restricted from usage by many countries of the world. With this, various researches were done in an effort to develop alternative solder. Several types of lead-free solder have been introduced with most common lead-free solders used nowadays are Sn-Ag-Cu and Sn-Cu. By introducing reinforcementto the solder can further be enhanced. Sn-Cu solder alloy were incorporated with graphite which acts as a reinforcement and the solder composites were produced by using powder metallurgy (PM) method which consists of mixing, compactingand sintering. This technique is economical as it produced low scrap with low energy consumption and needs no skilled worker to aperate the machines.