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A new invention of thermal pad using sol-gel nano-silver doped silica film in plastic leaded chip carrier (PLCC) application by using computational fluid dynamic sofrware, CFD analysis
(Trans Tech Publications, 2013)Thermal pad is new technology in the world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. Thermal Pad was made by using nano-silver as main material. Nano-silver ... -
Three dimensional simulation of thermal pad using nanomaterial, nano-silver in semiconductor and electronic component application
(Trans Tech Publications, 2013)Thermal pad is new technology in this world that been used in PLCC in order to reduce junction temperature to the minimum level in electronic components. In electronic industry, the electronic components that exceed 70°C ...