Browsing School of Microelectronic Engineering (Articles) by Subject "High power LED"

Now showing items 1-4 of 4

    • CuDia slug size variation analysis on heat dissipation of high power LED 

      Vairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr. (Trans Tech Publications, 2014-01)
      The current advancement of LED has prompt thermal challenges from the packaging point of view. The reliability of the LED is significantly influenced by each of its packaging component. This paper presents the investigation ...

    • Effects of heat slug shapes on the heat dissipation of high power LED 

      Zaliman, Sauli, Dr.; Vairavan, Rajendaran;; Retnasamy, Vithyacharan (Trans Tech Publications Inc., 2014-02)
      High power light emitting diodes are currently challenged by thermal issue of high heat generation which limits the reliability and efficiency. Each component in the LED package has a significant role in heat dissipation. ...

    • Heat sink fin number variation analysis on single chip high power LED 

      Zaliman, Sauli, Dr.; Vairavan, Rajendaran; Retnasamy, Vithyacharan (Trans Tech Publications, 2014-01)
      Thermal management of high power LED is crucial the reliability and performance of the LED affected by the heat produced during photon emission. Heat sinks are utilized to dissipate the heat and to lower the operating ...

    • Operating temperature analysis of LED with cylindrical Cu slug 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan (Trans Tech Publications, 2014-01)
      High power light emitting diodes is the new era of lighting due to momentous supremacy in terms of lighting efficacy over traditional lighting systems. The reliability of LED is dependent on its junction temperature. This ...