Browsing International Journal of Nanoelectronics and Materials (IJNeaM) by Subject "Grain size"

Now showing items 1-3 of 3

    • Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology 

      Siti Rahmah, Esa; Genesia, Omar; Siti Hajar, Sheikh Md Fadzullah; Kim, S. Siow; B. Abdul Rahim; B. Çoşut (Universiti Malaysia Perlis (UniMAP), 2020-05)
      Sintered Ag has gained strong interest as an important alternative material for interconnect technology in wide bandgap (WBG) semiconductor industries specifically for high thermal dissipations and high-speed applications. ...

    • The evolutions of microstructure in pressureless Sintered Silver die attach material 

      S.R., Esa; G., Omar; S.H. Sheikh, Md Fadzullah; K.S Siow; B., Abdul Rahim (Universiti Malaysia Perlis (UniMAP), 2021-04)
      Sintered silver (Ag) is one of the most promising interconnect materials for high temperature electronics applications due to its potential to withstand harsh and extreme environments. This paper investigates the microstructure ...

    • Synthesis and Characterization of Structural, Magnetic and Electrical Properties of Ni–Mn–Zn Ferrites 

      Hosney Ara, Begum; Nazia, Khatun; Suravi, Islam; Nurzaman Ara, Ahmed; Mohammad Sajjad, Hossain; Mohammad, Abdul Gafur; Ayesha, Siddika (Universiti Malaysia Perlis (UniMAP), 2018-01)
      Polycrystalline ferrites (NiXMnZn1−XFe2O4) were synthesized by a conventional ceramic method and sintered at 1100°C for 4 hours. The structure and surface morphology of the samples were characterized by X‐ray diffraction ...