Search
Now showing items 1-3 of 3
Temperature cycling analysis for ball grid array package using finite element analysis
(Emerald Group Publishing Limited, 2011)
Purpose – The purpose of this paper is to discuss the capability of finite element analysis (FEA) in performing the virtual thermal cycling reliability test to evaluate the reliability of solder joints in a ball grid array ...
Understanding the small world: an insight into the application of transmission electron microscopy in characterizing epitaxial layers
(Penerbit Universiti Malaysia Perlis, 2010-04)
Transmission electron microscopy (TEM) is an unrivalled technique for observing, characterizing and analyzing almost any type of materials. In physical science, the first observations of defects (i.e. dislocations) by TEM ...
Understanding the small world: an insight into the application of transmission electron microscopy in characterizing epitaxial layers
(Penerbit Universiti Malaysia Perlis, 2010-04)
Transmission electron microscopy (TEM) is an unrivalled technique for observing, characterizing and analyzing almost any type of materials. In physical science, the first observations of defects (i.e. dislocations) by TEM ...