Browsing School of Microelectronic Engineering (FYP) by Subject "Semiconductor devices"
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The Effect of Process Parameters on Metal Step Coverage for Aluminum by Evaporation Technique
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-03)The degree to which deposited metals cover steps over topography is important to the yield and reliability of devices in very large scale integrations (VLSI). In evaporated and sputtered thin films, the most difficult steps ... -
Investigation and Modeling of Boron Diffusion Reduction in Silicon by Flourine Implantation using Numerical Simulation
(Universiti Malaysia PerlisSchool of Microelectronic Engineering, 2007-05)With the increased interest in the use of fluorine co-implantation with boron for boron diffusion reduction in the fabrication of semiconductor devices, it is important to understand the mechanisms by which fluorine ...