Browsing School of Materials Engineering (FYP) by Author "Mohabattul Zaman S NS Bukhari, Prof. Madya Ir. (Advisor)"
Now showing items 1-2 of 2
-
Developing a mold technology module for freescale – study on effects of materials (compound properties) and molding process parameters on package moldability for QFP
Tan Hui Khin (Universiti Malaysia PerlisSchool of Materials Engineering, 2008-05)In integrated circuit (IC) Packaging, there are several processes involved. The main processes for leaded package are wafer mount, wafer saw, die attach, wire bonding, molding, plating, singulation, trim and form. Molding ... -
Effect of particle size and milling process on the microstructure and thermal properties of Copper Silicon Carbide (CuSiC) composites for electronic packing application
Chuah Run Yi (Universiti Malaysia PerlisSchool of Materials Engineering, 2008-03)Shrinking size and increasing functionality of IC device has induced serious thermal problem. Good thermal dissipation, light weight and easy-to-process material, such as CuSiC, is a highly potential heat spreader material ...