| dc.contributor.author | Mohd Khairuddin, Md Arshad | |
| dc.date.accessioned | 2010-10-06T02:20:10Z | |
| dc.date.available | 2010-10-06T02:20:10Z | |
| dc.date.issued | 2006-06 | |
| dc.identifier.citation | p.4-5 | en_US |
| dc.identifier.issn | 1823-9633 | |
| dc.identifier.uri | http://dspace.unimap.edu.my/123456789/9705 | |
| dc.language.iso | en | en_US |
| dc.publisher | Universiti Malaysia Perlis (UniMAP) | en_US |
| dc.relation.ispartofseries | Explore | en_US |
| dc.relation.ispartofseries | June 2006 | en_US |
| dc.subject | Environ -- Penerbitan Universiti | en_US |
| dc.subject | UniMAP -- Publications | en_US |
| dc.subject | UniMAP -- Pusat Pengajian Kejuruteraan Alam Sekitar | en_US |
| dc.subject | UniMAP -- Research and development | en_US |
| dc.subject | Under bump metallurgy (UBM) | en_US |
| dc.subject | Wafer bumping | en_US |
| dc.title | Wafer bumping: A comparative technologies study | en_US |
| dc.type | Article | en_US |
| dc.publisher.department | Pejabat Timbalan Naib Canselor (Penyelidikan dan Inovasi) | en_US |
