Browsing Institute of Nano Electronic Engineering (INEE) (Articles) by Title
Now showing items 195-206 of 206
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Taqman real-time polymerase chain reaction for the determination of pork adulteration in meat nuggets
(Vup Food Research Institute, 2012)A TaqMan real-time polymerase chain reaction was developed for the determination of pork adulteration in nuggets. The assay combined species-specific primers and TaqMan probe to target a 109 bp fragment of swine cytochrome ... -
Technical barriers and development of Cu wirebonding in nanoelectronics device packaging
(Hindawi Publishing Corporation, 2012)Bondpad cratering, Cu ball bond interface corrosion, IMD (intermetal dielectric) cracking, and uncontrolled post-wirebond staging are the key technical barriers in Cu wire development. This paper discusses the UHAST (unbiased ... -
Technology development for nano structure formation: Fabrication and characterization
(American Scientific Publishers, 2013)The paper contain a report on a technology development for nano structure formation using standard CMOS process-based method capable of fabricating precisely control nano wire and nanogap. The fabrication of nanoscale ... -
Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique
(Trans Tech Publications, 2014-01)The introduction of the metal matrix composites as the advanced electronic packaging materials is highly anticipated because their thermal properties can be engineered to match those of semiconductors, ceramics substrates ... -
The thermal expansion behaviors of Cu-SiCp composites
(Trans Tech Publications, 2013)The demand for advanced thermal management materials such as silicon carbide reinforced copper matrix (Cu-SiCp) composites is increasing due to their high thermal conductivity and low CTE properties. However, the weak ... -
Thin film thickness and uniformity measurement for lab-on-chip based nanoelectrode biosensor development
(Trans Tech Publications, 2014)One of the advantages of silicon substrate over other semiconductor substrate is the high temperature process capability of the silicon. In this work, silicon wafer is used for thermal processing which involves many high ... -
Three-dimensional channel design and fabrication in Polydimethylsiloxane (PDMS) elastomers using capillary action mechanism in fluidics for life sciences
(AENSI Publications, 2012-04)A simple design and fabrication for a 3D microchannel that could be used as a mixer in microfluidic flow system with minimum sample available, analysis using COMSOL 3.5 Multiphysics simulation and fabricated using ... -
Tribological properties of WS2 nanoparticles lubricants on aluminum-silicon alloy and carbon steels
(Walailak University, 2013-06)The rheological properties of nanometric tungsten disulphide (WS2) nanoparticles oil lubricants and its tribological performance with two hypereutectic Al-Si alloy and carbon steel are examined. These two oils are used to ... -
Wearout reliability and intermetallic compound diffusion kinetics of Au and PdCu wires used in nanoscale device packaging
(Hindawi Publishing Corporation, 2013)Wearout reliability and diffusion kinetics of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the HAST (with ... -
XPS and optical studies of different morphologies of ZnO nanostructures prepared by microwave methods
(Elsevier, 2013-04)Zinc oxide (ZnO) nanostructures of various morphologies were prepared using a microwave-assisted aqueous solution method. Herein, a comparative study between three different morphologies of ZnO nanostructures, namely ... -
ZnO nanorod ultraviolet photodetector on porous silicon substrate
(IOP Publishing Ltd, 2013)Vertically high-density ZnO nanorods were successfully synthesized on a porous silicon (PS) substrate by chemical bath deposition method. The structural and optical investigations revealed that the ZnO nanorods grown on ... -
ZnO thin film deposition on butterfly shaped electrodes for ultravioletsensing applications
(Elsevier GmbH, 2013-12)ZnO thin film was deposited on patterned gold electrodes using sol-gel spin coating technique. Conven-tional photo-lithography with wet etching process was used to create butterfly shaped 13-m gap fromzero gap chrome mask. ...