Mask Making Process (Positive and Negative Mask)

Abstract

Generally, two types of masks are used in MOSFET fabrication; positive mask and negative mask. These resists mask can be used either in lift off process or conventional lithography step depends on the fabrication process requirement. To achieve good resolution, Scanning Electron Microscopy (SEM) based E-beam lithography (EBL) was used to transfer the patern according the design. The patern was design in GDSII Editor in EBL System. Positive resist, Poly-methly-metacrylate (PMMA) and Negative resist, maN2403 were used as a resist in the EBL.