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dc.contributor.authorZul Azhar, Zahid Jamal, Assoc. Prof. Dr.
dc.contributor.authorSanna, Taking
dc.date.accessioned2009-07-08T08:36:36Z
dc.date.available2009-07-08T08:36:36Z
dc.date.issued2004-12-13
dc.identifier.citationp.1-6en_US
dc.identifier.urihttp://dspace.unimap.edu.my/123456789/6362
dc.descriptionOrganized by ELectron Microscopy Society of Malaysia (EMSM), 13th - 15th December 2004 at Palm Garden Hotel, Putrajaya.en_US
dc.description.abstractFailure analysis (FA) plays an important role in the development and manufacturing of integrated circuits. It provides necessary information for technology advancement and for corrective action to improve quality and reliability. In this paper the commonly used techniques in integrated circuits failure analysis are discussed. The paper also describes the basic FA flow consists of fault localization, deprocessing, defect localisation and inspection characterisation.en_US
dc.language.isoenen_US
dc.publisherELectron Microscopy Society of Malaysia (EMSM)en_US
dc.relation.ispartofseries13th Scientific Conference ELectron Microscopy Society of Malaysia (EMSM)en_US
dc.subjectFailure analysisen_US
dc.subjectIntegrated circuitsen_US
dc.subjectMicroelectronicsen_US
dc.subjectReliability (Engineering)en_US
dc.titleTechniques in Integrated Circuit (IC) failure analysisen_US
dc.typeWorking Paperen_US


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