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dc.contributor.authorUniversiti Malaysia Perlis (UniMAP)
dc.date.accessioned2018-05-19T01:44:14Z
dc.date.available2018-05-19T01:44:14Z
dc.date.issued2017-06
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/53045
dc.language.isoenen_US
dc.publisherUniversiti Malaysia Perlis (UniMAP)en_US
dc.relation.ispartofseriesPGT 332;Semester 2 2016/2017
dc.subjectExamination Paperen_US
dc.subjectPGT 332 -- Testen_US
dc.subjectSemiconductor Packaging -- Examination Paperen_US
dc.subjectPembungkusan Semikonduktor -- Examination Paperen_US
dc.titleSemiconductor Packagingen_US
dc.title.alternativePembungkusan Semikonduktoren_US
dc.typeOtheren_US


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