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dc.contributor.authorNurhafizah, Ku Abdullah
dc.date.accessioned2017-04-27T08:11:40Z
dc.date.available2017-04-27T08:11:40Z
dc.date.issued2016-06
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/47872
dc.description.abstractElectroplating of copper on aluminium alloy surface by using copper sulphate solution as an electrolyte solution. This study was done to analyse the influence of voltage (5V-25V) on electroplating of copper on aluminium alloy. The surface of aluminium alloy firstly ground and polished to remove oxide layer on the aluminium surface. Copper was plated by electroplating process. The sample was analysed by four testing that is optical microscope (OM), Scanning Electron Microscope (SEM), X-Ray Diffraction (XRD) and Hardness Vickers testing. After electroplating process, a reddish brown layer was deposited on the aluminium surface. The result from OM and SEM shows the microstructure of copper plated and thickness of the copper on aluminium alloy surface. Phase elements and structure of the crystals also found in the coating. Hardness value also obtained from hardness test.en_US
dc.description.sponsorshipAccess is limited to UniMAP community.en_US
dc.language.isoen_USen_US
dc.publisherUniversiti Malaysia Perlis (UniMAP)en_US
dc.subjectAluminium alloyen_US
dc.subjectAluminiumen_US
dc.subjectElectroplatingen_US
dc.subjectCopperen_US
dc.subjectCopper plantingen_US
dc.subjectCoatingen_US
dc.titleElectroplating copper on aluminium alloyen_US
dc.typeLearning Objecten_US
dc.contributor.advisorDr Zuraidawani Che Dauden_US
dc.publisher.departmentSchool of Materials Engineeringen_US


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