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dc.contributor.authorVincent, Darin Moreira Anthony
dc.contributor.authorRajamony, Bhuvenesh
dc.date.accessioned2016-11-30T06:28:53Z
dc.date.available2016-11-30T06:28:53Z
dc.date.issued2014
dc.identifier.citationAdvanced Semiconductor Manufacturing Conference (ASMC), 2014, pages 310-314en_US
dc.identifier.isbn978-1-4799-4928-1
dc.identifier.urihttp://ieeexplore.ieee.org/document/6847027/?reload=true
dc.identifier.urihttp://dspace.unimap.edu.my:80/xmlui/handle/123456789/44226
dc.descriptionLink to publisher's homepage at http://ieeexplore.ieee.orgen_US
dc.description.abstractSemiconductor manufacturing in an Assembly and Test Manufacturing (ATM) environment is becoming more challenging with continuous pressure of lowering overall operating cost and striving for perfect quality in the hope of gaining higher profit margins. One aspect that most semiconductor AT companies focus on is improving the capability and flexibility of the existing equipment to take on new products (without new equipment purchase) while supporting the legacy products without having any quality excursions. The case study presented is on a laser mark tool at Intel Malaysia's ATM site that showcases the ability to improve the overall capability of an existing tool to ensure process robustness and produce quality output by reengineering the process flow execution.en_US
dc.language.isoenen_US
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_US
dc.relation.ispartofseriesAdvanced Semiconductor Manufacturing Conference (ASMC);
dc.subjectCase studyen_US
dc.subjectIR laseren_US
dc.subjectQuality outputen_US
dc.subjectTRIZen_US
dc.subjectLaser marken_US
dc.subjectProcess Improvementen_US
dc.titleLaser marking equipment process $0 cost productivity improvementen_US
dc.typeArticleen_US
dc.identifier.doi10.1109/ASMC.2014.6847027
dc.contributor.urldarin.moreira.anthony.vincent@intel.comen_US
dc.contributor.urlbhuvenesh@unimap.edu.myen_US


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