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Surface roughness scrutinizaton with RIE CF₄+Argon gaseous on platinum deposited wafer
(Trans Tech Publications, 2014)
Aluminium metallization has a disadvantage when it comes to high-end applications as it cannot withstand the high temperature and pressure. This paper studies the factors that affect the surface roughness on a Platinum ...
Surface roughness analysis on reactive ion etched aluminium deposited wafer
(Trans Tech Publications, 2014)
This paper investigates the factors that affect the surface roughness on an Aluminium deposited wafer after reactive ion etching (RIE) using a combination of Tetrafluoromethane (CF₄) and Oxygen (O₂) gaseous. A total of ...
Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous
(Trans Tech Publications, 2014)
This paper investigates the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of SF₆ and Argon gaseous. A total of three controllable process ...
Wettability analysis on platinum deposited wafer after reactive ion ecthing using SF6+argon/CF4+argon gaseous
(AENSI Publisher All rights reserved, 2013-10)
Wettability in microfluidic has direct influence to its fluid flow channels. This paper investigates the variable parameters that affect the wetability in terms of contact angle on a Platinum deposited wafer after reactive ...