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LED heat dissipation analysis using composite based cylindrical slug
(Trans Tech Publications Inc., 2014-02)
The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports ...
Natural heat convection analysis on cylindrical Al slug of LED
(Trans Tech Publications, 2014-01)
This paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug ...
Wire bond shear test simulation
(Universiti Malaysia Perlis (UniMAP), 2012-06-18)
Wire bond shear test are utilized to appraise the reliability and the bond strength of wire bonded packages.In this study, a three-dimensional non linear finite element model was designed to simulate the stress response ...
Wire bond shear test simulation on sharp groove surface bond pad
(Trans Tech Publications, 2012-12)
Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded ...