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    Surface roughness scrutinizaton with RIE CF₄+Argon gaseous on platinum deposited wafer 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow; Siew Chui, Goh; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014)
    Aluminium metallization has a disadvantage when it comes to high-end applications as it cannot withstand the high temperature and pressure. This paper studies the factors that affect the surface roughness on a Platinum ...
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    Surface roughness analysis on reactive ion etched aluminium deposited wafer 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow (Trans Tech Publications, 2014)
    This paper investigates the factors that affect the surface roughness on an Aluminium deposited wafer after reactive ion etching (RIE) using a combination of Tetrafluoromethane (CF₄) and Oxygen (O₂) gaseous. A total of ...
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    Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous 

    Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow; Siew Chui, Goh; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014)
    This paper investigates the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of SF₆ and Argon gaseous. A total of three controllable process ...

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    Author
    Aaron, Koay Terr Yeow (3)
    Retnasamy, Vithyacharan (3)
    Zaliman, Sauli, Dr. (3)Khairul Anwar, Mohamad Khazali (2)Nooraihan, Abdullah (2)... View MoreSubject
    DOE (3)
    Reactive Ion Etching (RIE) (3)Surface roughness (3)Platinum (2)Aluminum (1)... View MoreDate Issued
    2014 (3)

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