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Shear speed analysis on Sn-3.9Ag-0.6Cu Solder
(Trans Tech Publications (TTP), 2013)
Ball Grid Array (BGA) is a type of semiconductor interconnection used in Integrated Circuit (IC) which is being scaled down to micro and nano size. The reliability of BGA in IC becomes a concern as the size of IC reduces. ...
Low density fibrous material surface light reflectance analysis
(AENSI Publisher All rights reserved, 2013-10)
The light based surface finishing of most product measurement is an important feature in the industries. In this paper, a lab fabricated tester for investigation on the quality of low density paper which was represent by ...