Search
Now showing items 11-20 of 22
Main effects study on plasma etched aluminium metallization
(Trans Tech Publications, 2014-01)
Main effects contributing to the quality of surface roughness on an etched aluminium metallization wafer using Reactive Ion Etching (RIE) was studied. A total of three controllable process variables, with eight sets of ...
WSS investigation in microfluidic FFS channel at Re 500
(Trans Tech Publications, 2014-01)
Wall shear stress (WSS) is one of the important variables in microfluidic devices. In this paper WSS distribution for a microfluidic device in Forward Facing Step (FFS) configuration has been investigated using Reynolds ...
Heat sink fin number variation analysis on single chip high power LED
(Trans Tech Publications, 2014-01)
Thermal management of high power LED is crucial the reliability and performance of the LED affected by the heat produced during photon emission. Heat sinks are utilized to dissipate the heat and to lower the operating ...
BaₓSr₁-ₓ TiO₃ different thickness analysis using sol gel approach
(Trans Tech Publications, 2014-01)
Barium Strontium Titanate (BST) a common topic in the microelectronic field for many devices which is mainly on dynamic random access memories (DRAM). There are many methods of preparing BaₓSr₁-ₓTiO3; barium strontium ...
Fibrous material density difference analysis using light reflectance
(Trans Tech Publications, 2014)
The objective of this work is designed and fabricated a lab module tester to differentiate the different type of printing paper quality which available commercially was done. Laser light source was used to differentiate ...
LED heat dissipation analysis using composite based cylindrical slug
(Trans Tech Publications Inc., 2014-02)
The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports ...
Natural heat convection analysis on cylindrical Al slug of LED
(Trans Tech Publications, 2014-01)
This paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug ...
Velocity profile investigation of FFS microchannel at Re 100
(Trans Tech Publications, 2014)
Recently, microfluidics system has been widely employed in various areas for instance biomedical,pharmaceuticals and cell biological researchdue to its advantages. The flow behavior in microchannels with different ...
CuDia slug size variation analysis on heat dissipation of high power LED
(Trans Tech Publications, 2014-01)
The current advancement of LED has prompt thermal challenges from the packaging point of view. The reliability of the LED is significantly influenced by each of its packaging component. This paper presents the investigation ...
Operating temperature analysis of LED with cylindrical Cu slug
(Trans Tech Publications, 2014-01)
High power light emitting diodes is the new era of lighting due to momentous supremacy in terms of lighting efficacy over traditional lighting systems. The reliability of LED is dependent on its junction temperature. This ...