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    • CuDia slug size variation analysis on heat dissipation of high power LED 

      Vairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr. (Trans Tech Publications, 2014-01)
      The current advancement of LED has prompt thermal challenges from the packaging point of view. The reliability of the LED is significantly influenced by each of its packaging component. This paper presents the investigation ...