Browsing Zaliman Sauli, Lt. Kol. Professor Dr. by Title
Now showing items 14-33 of 55
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Fibrous material density difference analysis using light reflectance
(Trans Tech Publications, 2014)The objective of this work is designed and fabricated a lab module tester to differentiate the different type of printing paper quality which available commercially was done. Laser light source was used to differentiate ... -
Fibrous material surface reflectance analysis
(Trans Tech Publications, 2014)The light inspection on surface finishing of most product measurement is an important feature in the industries. In this study, a lab module tester for examination on the different type quality of tissue paper quality was ... -
Film bulk acoustic wave resonator filter for Ku-band applications
(Trans Tech Publications (TTP), 2013)The design and analysis of Ku-band ladder-type filters based on film bulk acoustic wave resonator (FBAR) is presented. The proposed FBAR filter has an insertion loss of -3dB, out-of-band rejection of -12dB, centre frequency ... -
Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS
(Emerald Group Publishing Limited, 2013)Purpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection ... -
FSS microchannel fluid flow profile investigation at high and low Re number
(AENSI Publisher All rights reserved, 2013-10)The fundamental understanding of dynamic fluid flow behavior in different geometry channel is crucial due to transport phenomena influence on the key design and process control of the microfluidic systems. Recently, the ... -
Heat dissipation analysis under natural convection condition on high power LED
(AENSI Publisher All rights reserved, 2013-10)As the technology downscales with superior power and increased package density, the thermal effects of the high power LED are significant. Thus, the operating junction temperature of the high power light emitting diodes ... -
Heat sink fin number variation analysis on single chip high power LED
(Trans Tech Publications, 2014-01)Thermal management of high power LED is crucial the reliability and performance of the LED affected by the heat produced during photon emission. Heat sinks are utilized to dissipate the heat and to lower the operating ... -
Height measurement based on fringe projection
(Trans Tech Publications, 2014)A three-dimensional surface measurement using fringe projection technique has received attention among the researches for the last few decades.However choosing the best method is the challenge because one needs to consider ... -
High power LED heat dissipation analysis via copper diamond slug
(AENSI Publisher All rights reserved, 2013-10)The emergence of high power light emitting diode as a novel electronic based light source is due to its vast advantage in terms of optical efficacy, low power consumption and enhanced life time. However, the performances ... -
Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE
(Trans Tech Publications, 2014)This paper presents the interaction relationships between Tetrafluoromethane (CF₄) gas, Oxygen (O₂) gas, and RF power in response to the surface roughness of an Aluminium deposited wafer after being etched using Reactive ... -
Interrogation of surface roughness and bond force effect
(AENSI Publisher All rights reserved, 2013-10)In the macro world surface roughness is a feature undoubtedly not to be ignored. In the current trend towards the nano-scale feature in the devices related to the semiconductor and other various niche, surface roughness ... -
Investigation of dielectric characteristics and tunability of Ba0.8Sr0.2TiO3
(AENSI Publisher All rights reserved, 2013-10)It's been years ferroelectric materials has become a popular fields for research. Many methods were used for the barium strontium titanate (BST) preparation like sol-gel method, radio frequency (RF) magnetron sputtering, ... -
Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous
(Trans Tech Publications, 2014)This paper investigates the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of SF₆ and Argon gaseous. A total of three controllable process ... -
Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology
(Emerald Group Publishing Limited, 2013)Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment ... -
LED heat dissipation analysis using composite based cylindrical slug
(Trans Tech Publications Inc., 2014-02)The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports ... -
LED heat dissipation study using different Cu slug size
(AENSI Publisher All rights reserved, 2013-10)High power light emitting diodes (LEDs) have significant contribution in illumination industry due exceptional advantages in terms of low power consumption, superior reliability, prolonged life time and high efficiency. ... -
Low density fibrous material surface light reflectance analysis
(AENSI Publisher All rights reserved, 2013-10)The light based surface finishing of most product measurement is an important feature in the industries. In this paper, a lab fabricated tester for investigation on the quality of low density paper which was represent by ... -
Main effects study on plasma etched aluminium metallization
(Trans Tech Publications, 2014-01)Main effects contributing to the quality of surface roughness on an etched aluminium metallization wafer using Reactive Ion Etching (RIE) was studied. A total of three controllable process variables, with eight sets of ... -
Microfluidic channel depth determination with Tywman-Green interferometer
(Springer-Verlag London., 2013-07)A microfluidic channel is fabricated on a silica wafer using reactive ion etching (RIE). The depth of the microfluidic channel has been measured using a surface profilometer and a Twyman-Green interferometer (TGI) setup. ... -
Natural heat convection analysis on cylindrical Al slug of LED
(Trans Tech Publications, 2014-01)This paper presents the characterization of a single chip high power LED package through simulation. Ansys version 11 was used for the simulation. The characterization of the LED package with aluminum cylindrical heat slug ...