Now showing items 10-29 of 55

    • Design and analysis of film bulk acoustic wave resonator in Ku-band frequency for wireless communication 

      Nurul Izza, Mohd Nor; Shah, Kriyangbhai; Singh, Jugdutt, Prof.; Nazuhusna, Khalid, Dr.; Zaliman, Sauli, Prof. Madya Dr. (Society of Photo-Optical Instrumentation Engineers (SPIE), 2012-03-12)
      This paper presents design of a Film Bulk Acoustic Wave Resonators (FBARs) consisting of piezoelectric film, aluminium nitride (AlN) with top and bottom electrodes of ruthenium (Ru). The lumped Butterworth-Van Dyke (BVD) ...
    • Design and analysis of wideband ladder-type film bulk acoustic wave resonator filters in Ku-band 

      Nurul Izza, Mohd Nor, Dr.; Kriyang, Shah; Singh, Jugdutt; Zaliman, Sauli, Dr. (Hindawi Publishing Corporation, 2013)
      This paper presents the design of ladder-type filters based on film bulk acoustic wave resonator (FBAR) in Ku-band. The proposed FBAR filter has an insertion loss of -3 dB, out-of-band rejection of -12 dB and 3 dB bandwidth ...
    • Design and simulation of film bulk acoustic wave resonator in kuband 

      Nurul Izza, Mohd Nor, Dr.; Kriyang, Shah; Singh, Jugdutt; Zaliman, Sauli, Dr. (Trans Tech Publications, 2013)
      This paper presents the design of a Film Bulk Acoustic Wave Resonators (FBARs) operating in Ku-band. The one-dimensional (1-D) numerical and the three-dimension (3-D) Finite Element Method (FEM) simulation results are ...
    • Effects of heat slug shapes on the heat dissipation of high power LED 

      Zaliman, Sauli, Dr.; Vairavan, Rajendaran;; Retnasamy, Vithyacharan (Trans Tech Publications Inc., 2014-02)
      High power light emitting diodes are currently challenged by thermal issue of high heat generation which limits the reliability and efficiency. Each component in the LED package has a significant role in heat dissipation. ...
    • Fibrous material density difference analysis using light reflectance 

      Ong, Tee Say; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014)
      The objective of this work is designed and fabricated a lab module tester to differentiate the different type of printing paper quality which available commercially was done. Laser light source was used to differentiate ...
    • Fibrous material surface reflectance analysis 

      Ong, Tee Say; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Nur Izza, Mohd Nor; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014)
      The light inspection on surface finishing of most product measurement is an important feature in the industries. In this study, a lab module tester for examination on the different type quality of tissue paper quality was ...
    • Film bulk acoustic wave resonator filter for Ku-band applications 

      Nurul Izza, Mohd Nor, Dr.; Kriyang, Shah; Singh, Jugdutt; Zaliman, Sauli, Dr. (Trans Tech Publications (TTP), 2013)
      The design and analysis of Ku-band ladder-type filters based on film bulk acoustic wave resonator (FBAR) is presented. The proposed FBAR filter has an insertion loss of -3dB, out-of-band rejection of -12dB, centre frequency ...
    • Finite element analysis of thermal distributions of solder ball in flip chip ball grid array using ABAQUS 

      Yap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan (Emerald Group Publishing Limited, 2013)
      Purpose - The increased use recently of area-array technology in electronic packaging has similarly increased the importance of predicting the thermal distribution of area-array solder interconnection. As the interconnection ...
    • FSS microchannel fluid flow profile investigation at high and low Re number 

      Nor Shakirina, Nadzri; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Tan, Hsio Mei; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      The fundamental understanding of dynamic fluid flow behavior in different geometry channel is crucial due to transport phenomena influence on the key design and process control of the microfluidic systems. Recently, the ...
    • Heat dissipation analysis under natural convection condition on high power LED 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      As the technology downscales with superior power and increased package density, the thermal effects of the high power LED are significant. Thus, the operating junction temperature of the high power light emitting diodes ...
    • Heat sink fin number variation analysis on single chip high power LED 

      Zaliman, Sauli, Dr.; Vairavan, Rajendaran; Retnasamy, Vithyacharan (Trans Tech Publications, 2014-01)
      Thermal management of high power LED is crucial the reliability and performance of the LED affected by the heat produced during photon emission. Heat sinks are utilized to dissipate the heat and to lower the operating ...
    • Height measurement based on fringe projection 

      Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Nor Shakirina, Nadzri; Veriven, Christopher John (Trans Tech Publications, 2014)
      A three-dimensional surface measurement using fringe projection technique has received attention among the researches for the last few decades.However choosing the best method is the challenge because one needs to consider ...
    • High power LED heat dissipation analysis via copper diamond slug 

      Vairavan, Rajendaran; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      The emergence of high power light emitting diode as a novel electronic based light source is due to its vast advantage in terms of optical efficacy, low power consumption and enhanced life time. However, the performances ...
    • Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow; Wei Wei, Ng (Trans Tech Publications, 2014)
      This paper presents the interaction relationships between Tetrafluoromethane (CF₄) gas, Oxygen (O₂) gas, and RF power in response to the surface roughness of an Aluminium deposited wafer after being etched using Reactive ...
    • Interrogation of surface roughness and bond force effect 

      Zaliman, Sauli, Dr. (AENSI Publisher All rights reserved, 2013-10)
      In the macro world surface roughness is a feature undoubtedly not to be ignored. In the current trend towards the nano-scale feature in the devices related to the semiconductor and other various niche, surface roughness ...
    • Investigation of dielectric characteristics and tunability of Ba0.8Sr0.2TiO3 

      Nurhafizah, Ramli; Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; They, Yee Chin; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      It's been years ferroelectric materials has become a popular fields for research. Many methods were used for the barium strontium titanate (BST) preparation like sol-gel method, radio frequency (RF) magnetron sputtering, ...
    • Investigation of surface roughness on platinum deposited wafer after reactive ion etching using SF₆+Argon gaseous 

      Zaliman, Sauli, Dr.; Retnasamy, Vithyacharan; Aaron, Koay Terr Yeow; Siew Chui, Goh; Khairul Anwar, Mohamad Khazali; Nooraihan, Abdullah (Trans Tech Publications, 2014)
      This paper investigates the factors that affect the surface roughness on a Platinum deposited wafer after reactive ion etching (RIE) using a combination of SF₆ and Argon gaseous. A total of three controllable process ...
    • Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology 

      Yap, Boon Kar, Dr.; Noor Azrina, Talik; Zaliman, Sauli, Dr.; Foong, Chee Seng; Tan, Chou Yong, Dr.; Retnasamy, Vithyacharan (Emerald Group Publishing Limited, 2013)
      Purpose - This paper aims to discuss the effects of ionic contaminations on the die surface of high lead flip chip ball grid array (FCBGA) package. Ionic contaminations from the flux residue, formed during the die attachment ...
    • LED heat dissipation analysis using composite based cylindrical slug 

      Zaliman, Sauli, Dr.; Vairavan, Rajendaran; Retnasamy, Vithyacharan (Trans Tech Publications Inc., 2014-02)
      The optical efficacy and reliability of light emitting diode is extensively influenced by the operating junction temperature of the LED. Therefore, the evaluation of junction temperature is significant. This paper reports ...
    • LED heat dissipation study using different Cu slug size 

      Vairavan, Rajendaran; Retnasamy, Vithyacharan; Zaliman, Sauli, Dr.; Kamarudin, Hussin, Brig. Jen. Dato' Prof. Dr. (AENSI Publisher All rights reserved, 2013-10)
      High power light emitting diodes (LEDs) have significant contribution in illumination industry due exceptional advantages in terms of low power consumption, superior reliability, prolonged life time and high efficiency. ...