Show simple item record

dc.contributor.authorPhua, J. L.
dc.contributor.authorThe, Peter L.
dc.contributor.authorSupri, Abdul Ghani
dc.contributor.authorYeoh, Cheow Keat, Dr.
dc.contributor.authorIshak, S. N.
dc.date.accessioned2014-05-16T07:03:21Z
dc.date.available2014-05-16T07:03:21Z
dc.date.issued2013
dc.identifier.citationAdvanced Materials Research, vol. 795, 2013, pages 407- 413en_US
dc.identifier.issn1022-6680
dc.identifier.urihttp://www.scientific.net/AMR.795.407
dc.identifier.urihttp://dspace.unimap.edu.my:80/dspace/handle/123456789/34451
dc.descriptionLink to publisher's homepage at http://www.ttp.net/en_US
dc.description.abstractA blend system between two different thermoset polymer, epoxy and unsaturated polyester at ratio 80/20 weight percentage (wt. %) with 10, 20, 30 and 40 volume percentage (vol. %) of recycled copper powder as conductive filler was investigated. The conductive polymer blend composites were undergone some characterization and testing which include flexural properties, hardness, thermal stability, electrical properties and scanning electron microscopy (SEM). The flexural strength of the unfilled system decreased as increasing of the recycled copper powder content. With the increase of recycled copper, from 0 vol.% to 40 vol.%, a total 350% of increment in flexural modulus was observed. The thermal stability of the blend polymer increased with the filler loading, from 140°C to 300°C, which was the 5% weight loss onset degradation temperature. The electrical conductivity properties of the blend composite shown the percolation threshold at 30 - 40 vol.% of recycled copper powder filler content, where the conductive blend composites change from insulator to conductor.en_US
dc.language.isoenen_US
dc.publisherTrans Tech Publicationsen_US
dc.subjectEpoxyen_US
dc.subjectPolymer blenden_US
dc.subjectRecycled copperen_US
dc.subjectUnsaturated polyesteren_US
dc.titleThe properties of recycled copper filled epoxy/unsaturated polyester compositesen_US
dc.typeArticleen_US
dc.identifier.url10.4028/www.scientific.net/AMR.795.407
dc.contributor.urljoaquimphua@gmail.comen_US
dc.contributor.urlyck5@yahoo.comen_US


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record