Search
Now showing items 1-5 of 5
Synthesis of sol-gel silica chemically bonded with cyanex 272 for the removal of Cu(II), Ni(II), and Zn(II)
(Springer Netherlands, 2009-05)
This article reported on the synthesis of SSCBB, a new solid-phase, sol-gel silica chemically bonded with [bis (2,4,4-trimethylpentyl) phosphinate], (BTMPP, anion of Cyanex 272) prepared with a sol-gel method, and its ...
Selective leaching for the recovery of Copper from PCB
(Universiti Malaysia Perlis, 2009-12-01)
This paper reported on the leaching behavior of printed circuit board (PCB) using a new leaching agent of ammonia-ammonium persulfate, to recover copper. Cu and Zn leaching were found to be fast and reached equilibrium in ...
Solid state sintering of Co-Cr-Mo (F 75): Microstructure and properties
(SIRIM, 2010-11-22)
The influence of sintering temperature to the physical properties of P/M Co-Cr-Mo (F-75) alloy
(Universiti Malaysia Perlis, 2009-12-01)
Co-Cr-Mo (F-75) alloys are commonly used for surgical implants because of their strength, corrosion resistance and biocompatibility. Conventionally, fabrication of the alloys has been established using casting technique. ...
The influence of welding parameters and corrosive environment on the joint strength of resistance spot-welded mild steel sheets
(Universiti Malaya, 2009)
In the present work, mild steel sheets consisting two batches were welded by resistance spot welding at different welding parameters and exposed under different environments. The 5% sodium chloride brine was used in the ...