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A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
(Syscom 18 SRL, 2013-07)
The properties of Sn-0.7Cu solder bulk prepared via the powder metallurgy (PM) method were investigated and compared with solder bulk fabricated through casting. Distinct microstructures were observed in both PM and casting ...
The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering
(Elsevier, 2019-10)
This paper elucidated the effects of the Bi element (0 wt%, 0.5 wt% and 1.5 wt%) on the microstructure, electrical, wettability and mechanical properties of the Sn-0.7Cu-0.05Ni as a high strength solder. Besides using the ...