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An investigation of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite
(EDP Sciences, 2016)
In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution ...
Influence of Activated Carbon Particles on Intermetallic Compound Growth Mechanism in Sn-Cu-Ni Composite Solder
(EDP Sciences, 2016-10)
The influence of Activated Carbon (AC) particles on mechanical properties of Sn-Cu-Ni-xAC solder joint was investigated. Five different Activated Carbon (AC) percentage addition (0 wt. %, 0.25 wt. %, 0.5 wt. %, 0.75 wt. ...
The effect of thermal annealing on the microstructure and mechanical properties of Sn-0.7Cu-xZn solder joint
(MDPI AG, 2021-02)
The microstructural properties of a Pb-free solder joint significantly affect its mechanical behaviours. This paper details a systematic study of the effect of the annealing process on the microstructure and shear strength ...